SEMICONDUCTOR ELEMENT MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor element manufacturing method which can form an alloy layer on a semiconductor substrate without using a plating method.SOLUTION: A semiconductor element manufacturing method comprises: a sheet arrangement process of arranging a metal sheet 31 on a principal surface 2a of a semiconductor substrate 2; and an annealing process of forming an alloy layer 23 at a junction part between the semiconductor substrate 2 and the metal sheet 31 by annealing the semiconductor substrate 2 and the metal sheet 31.