发明名称 METHOD OF PRIMERLESS BONDING
摘要 PROBLEM TO BE SOLVED: To solve such problems that when a polycarbonate substrate is connected to a frame with a moisture-curable polyurethane adhesive, a coating on the substrate degrades a film, destroys the film, or causes cracks.SOLUTION: The present invention relates to methods for attaching a plastic component to another component where the plastic component is bonded to the other component with an adhesive in the absence of a primer on the plastic component and the adhesive is substantially solvent free. In one embodiment, a coated transparent or translucent polycarbonate substrate is connected to a frame with a polyurethane adhesive containing silicon in the absence of a primer on the substrate; or with a substantially solvent free adhesive. This invention also relates to bonded articles made according to the disclosed methods.
申请公布号 JP2013155387(A) 申请公布日期 2013.08.15
申请号 JP20130108684 申请日期 2013.05.23
申请人 DOW GLOBAL TECHNOLOGIES LLC 发明人 MAHDI SYED ZAFAR;BURRIS MARCY NICOLE;HENDERSON MICHELLE M
分类号 C09J175/04;C09J11/06 主分类号 C09J175/04
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