| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate assembly which enhances the yield of individualized substrates by reducing occurrence of cracking in a direction other than the direction of a groove formed in the substrate assembly when individualizing the substrate assembly, an electronic device including the same, and a method of manufacturing the substrate assembly.SOLUTION: A substrate assembly 40 includes first two grooves (grooves 48A) extending in parallel, second two grooves (grooves 48C) extending in parallel while intersecting the first grooves (grooves 48A), and split grooves (grooves 48B and 48D) for splitting a region (central part 42) surrounded with the first grooves (groove 48A) and the second grooves (groove 48C) into a plurality of substrate regions 44. In the substrate assembly 40, the grooves (grooves 48A-48D) have recesses 24 at the ends in the longitudinal direction. |
