发明名称 HEAT EXCHANGER COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat exchanger cooling device which can easily be employed without installing a huge facility on the assumption that the adhesion of a scale to a heat dissipation fin is prevented and water to be used is saved.SOLUTION: In a heat exchanger cooling device 1, an ion exchange resin is filled in a column 12 so that an SV value at a water spray of ion-exchanged water to a heat dissipation fin 23 may be 0.2 to 10. The heat exchanger cooling device is constituted so that water may be sprayed only when it is estimated that the heat dissipation fin 23 is brought into a dried state, and can spray water to the heat dissipation fin 23 at tap water pressure without using a pump.
申请公布号 JP2013155901(A) 申请公布日期 2013.08.15
申请号 JP20120015203 申请日期 2012.01.27
申请人 KUREATERA:KK 发明人 YANAGIDA TOMOTAKA
分类号 F24F11/02;F24F1/42;F25B39/04 主分类号 F24F11/02
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