| 摘要 |
<p>A film forming apparatus (21) forms a film on a substrate to be processed (11), on the surface of which a patterned mask member (14) is fitted. The film forming apparatus (21) is provided with: a processing chamber (33) which is capable of internally containing the substrate to be processed (11); a vapor deposition mechanism for performing vapor deposition on a surface of the substrate to be processed (11), on said surface the mask member (14) being fitted; and a cooling mechanism (40) for cooling the mask member (14). The cooling mechanism (40) comprises a cooling member which is capable of cooling the mask member (14) at a position apart from the mask member (14).</p> |
