| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition for a semiconductor package, which has excellent molding processability such as transfer moldability and has high light resistance and heat resistance.SOLUTION: The invention relates to a curable resin composition for a semiconductor package comprising, as essential components, (A) an organic compound having at least two carbon-carbon double bonds which have reactivity with an SiH group in one molecule, (B) a compound having at least two SiH groups in one molecule and (C) a hydrosilylation catalyst. |
