| 摘要 |
PROBLEM TO BE SOLVED: To provide a physical quantity sensor that relaxes thermal stress from an outer circumferential part of a diaphragm of a SON structure and is inexpensive and accurate, and further to provide a manufacturing method for the sensor.SOLUTION: By disposing a stress relaxation area (trench 5) in an outer circumferential part of a diaphragm 7 of a SON structure 22, transmission of a thermal stress generated by a difference in linear expansion coefficients between a package 80 and a chip 27 to the diaphragm 7 can be reduced, and transmission of a mechanical stress generated by a measured pressure F to an electronic circuit 11 arranged in the outer circumferential part can be reduced. As a result, a highly accurate physical quantity sensor 100 can be obtained. |
