| 摘要 |
A deposition ring is used on thin film deposition equipment which includes a chuck to hold a wafer. The deposition ring is arranged on the circumferential wall of the chuck and includes an inner ring and a protective member. The inner ring is adjacent to the circumferential wall. The protective member is jutting from the inner ring and has a circumferential surface, a barrier surface and a tip edge. The circumferential surface opposes the circumferential wall. The barrier surface and circumferential surface form an acute angle between them. The tip edge is formed between the circumferential surface and barrier surface. Through the protective member, the probability of adhering deposition particles to the back of the wafer is greatly reduced. The protective member is formed in a structure with a gradually increasing bottom, hence can provide higher stress resistant capability and overcome the easy fracturing problem in the conventional techniques.
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