ADHESIVE/SEALANT PREFERABLY USED FOR CONSTRUCTION PANELS

摘要

Adhesive/sealant with lower thermal conductivity used for insulated glass units (IGUs) and gas filled insulation construction panels (GFPs), said adhesive/sealant comprising hollow mineral and/or organic microspheres in its structure. The thermal conductivity of the adhesive/sealant is less than 0.30 W/mK, preferably less than 0.25 W/mK. Chemical and mechanical properties of such adhesive/sealant mass are comparable to existing sealants used for IGUs and GFPs.