PREPREG FOR HOT PRESS MOLDING AND LAMINATED BOARD

摘要

PROBLEM TO BE SOLVED: To provide a prepreg for hot press molding, from which an insulating layer, that has excellent circuit embeddability, good thermal conductivity and is thin, is obtained.SOLUTION: The prepreg for hot press molding is obtained by impregnating a nonwoven glass fabric base material with an inorganic filler-containing thermocurable resin composition and drying the resulting nonwoven glass fabric base material. The thermocurable resin composition has a thermal conductivity ≥0.5 W/m K and the nonwoven glass fabric base material has ≤100 μm thickness.