发明名称 |
PRE-CUT WAFER APPLIED UNDERFILL FILM |
摘要 |
A method for preparing a semiconductor with preapplied underfill comprises providing a semiconductor wafer with a plurality of metallic bumps on its top side and, optionally, through-silica-vias vertically through the silicon wafer; laminating a back grinding tape to the top of the wafer covering the metallic bumps and through silicon vias; thinning the back side of the wafer; mounting a dicing tape to the back side of the thinned wafer and mounting the silicon wafer and dicing tape to a dicing frame; removing the back grinding tape; providing an underfill material precut into the shape of the wafer; aligning the underfill on with the wafer and laminating the underfill to the wafer.
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申请公布号 |
US2013210239(A1) |
申请公布日期 |
2013.08.15 |
申请号 |
US201313800862 |
申请日期 |
2013.03.13 |
申请人 |
HENKEL CORPORATION;HENKEL CORPORATION |
发明人 |
KIM YOUNSANG;HOANG GINA;GUINO ROSE |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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