| 摘要 |
A printed circuit board device (1) includes a printed circuit board (2), a semiconductor device (8) and a capacitor element (9) mounted on the printed circuit board (2), a ground conductor plane (13) to which a ground terminal (8b)of the semiconductor device is connected, and first (11) and second (12) power source conductor planes which are arranged so as not to contact with each other. The second power source conductor plane (12) and the ground conductor plane (13) are arranged so as to oppose to each other to form a planar capacitor (14). The printed circuit board has a first connecting conductor (21) which connects a power source terminal (8a) of the semiconductor device with the second power source conductor plane (12), and a second connecting conductor (22) which connects the first power source conductor plane (11) with the second power source conductor plane (12) through a first terminal (9a) of the capacitor element, and a third connecting conductor (23) connecting the grounding plane (13) to a second terminal (9b) of the capacitor element, and a fourth conductor (24) connecting the ground terminal (8b) to the grounding plane (13). Thereby, an electromagnetic radiation noise is reduced. |
