Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct.
申请公布号
WO2013086277(A3)
申请公布日期
2013.08.15
申请号
WO2012US68378
申请日期
2012.12.07
申请人
PPG INDUSTRIES OHIO, INC.;DESAI, UMESH C.;CHAO, TIEN-CHIEH;NAKAJIMA, MASAYUKI;RAGUNATHAN, KALIAPPA G.
发明人
DESAI, UMESH C.;CHAO, TIEN-CHIEH;NAKAJIMA, MASAYUKI;RAGUNATHAN, KALIAPPA G.