发明名称 |
PHOTOCURABLE RESIN COMPOSITION CONTAINING FINE METAL PARTICLES AND USE OF SAME |
摘要 |
<p>A photocurable resin composition containing fine metal particles, which contains (A) conductive fine particles and (B) a photocurable resin composition. The content of the conductive fine particles (A) in the composition is within the range of 62-86% by weight relative to the total weight of the composition, and the conductive fine particles (A) have the following physical properties. (i) The 50% average particle diameter is 0.1-5 mum. (ii) The tap density is 2.5 g/cm3 or less. (iii) The BET specific surface area is 1.5 m2/g or less.</p> |
申请公布号 |
WO2013118875(A1) |
申请公布日期 |
2013.08.15 |
申请号 |
WO2013JP53090 |
申请日期 |
2013.02.08 |
申请人 |
DAISO CO., LTD. |
发明人 |
IWASA, NARUHITO;MINAMI, JUNICHIRO |
分类号 |
C08L101/12;C08K3/08;G03F7/004;G03F7/031;H01B1/22;H05K1/09 |
主分类号 |
C08L101/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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