发明名称 PHOTOCURABLE RESIN COMPOSITION CONTAINING FINE METAL PARTICLES AND USE OF SAME
摘要 <p>A photocurable resin composition containing fine metal particles, which contains (A) conductive fine particles and (B) a photocurable resin composition. The content of the conductive fine particles (A) in the composition is within the range of 62-86% by weight relative to the total weight of the composition, and the conductive fine particles (A) have the following physical properties. (i) The 50% average particle diameter is 0.1-5 mum. (ii) The tap density is 2.5 g/cm3 or less. (iii) The BET specific surface area is 1.5 m2/g or less.</p>
申请公布号 WO2013118875(A1) 申请公布日期 2013.08.15
申请号 WO2013JP53090 申请日期 2013.02.08
申请人 DAISO CO., LTD. 发明人 IWASA, NARUHITO;MINAMI, JUNICHIRO
分类号 C08L101/12;C08K3/08;G03F7/004;G03F7/031;H01B1/22;H05K1/09 主分类号 C08L101/12
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