发明名称
摘要 A heat exchanger component is made by forming a wafer having a pair of opposed outer major faces with interstices between them from a stack of wire mesh screens. The outer major surfaces of the wafer are sealed by depositing a metal coating on them. The deposited metal coatings define between them a flow path for a heat exchange fluid extending through the interstices of the wafer.
申请公布号 JP2013532264(A) 申请公布日期 2013.08.15
申请号 JP20130508335 申请日期 2011.05.04
申请人 发明人
分类号 F28D1/03;B23P15/26;F24H9/00;F28F3/00;F28F3/06 主分类号 F28D1/03
代理机构 代理人
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