| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device which, even when using a compound semiconductor element operable at a high temperature, is capable of securing adhesion between the semiconductor element and a mold resin.SOLUTION: The semiconductor device is formed by sealing, with a sealing resin, a mounting body in which a semiconductor element is mounted on a metal member. The surface of the semiconductor element 1 is hydrophilic. A coupling agent 9 having a first reactive group to be bonded to an inorganic material and a second reactive group to be bonded to an organic material is interposed at an interface between the semiconductor element 1 and the sealing resin 8. |
