WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which efficiently transmits heat generated by an electronic component connected with one surface of a substrate to a heat sink disposed on the other surface side of the substrate.SOLUTION: A wiring board includes: an insulation substrate; a wiring layer formed on one surface of the insulation substrate and having a predetermined wiring pattern; an insulation layer formed on the wiring layer and exposing a part of the wiring layer as a terminal; a heat sink disposed on the other surface side of the insulation substrate; and a heat conduction part which is formed in a through hole penetrating through a space between the one surface of the insulation substrate and the other surface and is connected with the wiring layer.