发明名称 |
ELECTRONIC CIRCUIT MODULE COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To improve the heat resistance and the cyclic bending strength of a joining metal for joining a terminal electrode of an electronic component of an electronic circuit module component with a terminal electrode of a circuit board.SOLUTION: An electronic circuit module component includes: an electronic component 2; a circuit board 3 mounted with the electronic component 2; and joining metal 5 which is interposed between a terminal electrode 2T of the electronic component 2 and a terminal electrode 3T of the circuit board 3, and which joins both. In the joining metal 5, a main phase mainly consisting of Ni-Sn alloy and a second phase mainly consisting of either Bi or Zn are dispersed. |
申请公布号 |
JP2013154354(A) |
申请公布日期 |
2013.08.15 |
申请号 |
JP20120014550 |
申请日期 |
2012.01.26 |
申请人 |
TDK CORP |
发明人 |
YASUI TSUTOMU;MUROI MASAYUKI;KITAMURA TOMOKO;YOSHIDA KENICHI;ABE TOSHIYUKI |
分类号 |
B23K35/22;B22F1/00;B23K35/26;B23K35/30;C22C13/02;C22C19/03;H01L21/60 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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