发明名称 ALUMINUM STRUCTURE, MANUFACTURING METHOD THEREOF, ALUMINUM STRUCTURE ASSEMBLY, ALUMINUM WIRING BOARD, SEMICONDUCTOR SYSTEM, AND SOLAR CELL MODULE
摘要 PROBLEM TO BE SOLVED: To provide an aluminum structure capable of being suitably soldered to an aluminum base body made from an aluminum only or an aluminum alloy in spite of a simple structure.SOLUTION: An aluminum structure 1 has a soldering section 3 for soldering to an aluminum surface 2a of the aluminum base body 2 made from the aluminum only or the aluminum alloy. The soldering section 3 has a metal layer section 4 made from metal except aluminum which can make an alloy with a solder, on the aluminum surface 2a. The layer thickness of the metal layer section 4 is a layer thickness capable of being penetrated by the solder in a layer thickness direction by making the metal layer section 4 melt into the solder at the time of soldering.
申请公布号 JP2013154392(A) 申请公布日期 2013.08.15
申请号 JP20120019015 申请日期 2012.01.31
申请人 TOPPAN PRINTING CO LTD 发明人 WARIKASHI AKIRA
分类号 B23K1/20;B23K1/00;B23K101/36;B23K101/42;B23K103/10;C23C18/32;C23C18/38;C23C28/00;H01L31/04;H05K1/09 主分类号 B23K1/20
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