发明名称 |
ALUMINUM STRUCTURE, MANUFACTURING METHOD THEREOF, ALUMINUM STRUCTURE ASSEMBLY, ALUMINUM WIRING BOARD, SEMICONDUCTOR SYSTEM, AND SOLAR CELL MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide an aluminum structure capable of being suitably soldered to an aluminum base body made from an aluminum only or an aluminum alloy in spite of a simple structure.SOLUTION: An aluminum structure 1 has a soldering section 3 for soldering to an aluminum surface 2a of the aluminum base body 2 made from the aluminum only or the aluminum alloy. The soldering section 3 has a metal layer section 4 made from metal except aluminum which can make an alloy with a solder, on the aluminum surface 2a. The layer thickness of the metal layer section 4 is a layer thickness capable of being penetrated by the solder in a layer thickness direction by making the metal layer section 4 melt into the solder at the time of soldering. |
申请公布号 |
JP2013154392(A) |
申请公布日期 |
2013.08.15 |
申请号 |
JP20120019015 |
申请日期 |
2012.01.31 |
申请人 |
TOPPAN PRINTING CO LTD |
发明人 |
WARIKASHI AKIRA |
分类号 |
B23K1/20;B23K1/00;B23K101/36;B23K101/42;B23K103/10;C23C18/32;C23C18/38;C23C28/00;H01L31/04;H05K1/09 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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