发明名称 RESIN COMPOSITION FOR IMPREGNATING LARGE-SCALED MOLD COIL AND LARGE-SCALED MOLD COIL USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin composition excellent in moldability for impregnating a large-scaled mold coil therewith that has a long life and can suppress resin dripping on molding and suppress generation of cracks and peeling caused by heat cycle when a large-scaled coil is molded.SOLUTION: A resin composition for impregnating a large-scaled mold coil therewith comprises a resin component and a curing agent component. The resin component (A) comprises a bisphenol A type epoxy resin, (B) a polypropylene glycol diglycidyl ether and (C) a trifunctional epoxy resin, where the content of the component (A) is 65-75 mass%, the content of the component (B) is 15-30 mass% and the content of the component (C) is 5-25 mass%, each based on 100 mass% of the total of the components (A)-(C). The curing agent component comprises (D) a diphenylamine curing agent and (E) an imidazole curing accelerator.
申请公布号 JP2013155346(A) 申请公布日期 2013.08.15
申请号 JP20120018714 申请日期 2012.01.31
申请人 KYOCERA CHEMICAL CORP 发明人 TSUNODA REI;ISHIBASHI HIROYASU;SASAKI ERI
分类号 C08G59/50;H01F41/12;H02K3/30 主分类号 C08G59/50
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