| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a resistance value does not change even if a pressure is applied to the device by bonding.SOLUTION: A first resistance element 20 composed of an n-type semiconductor and a second resistance element 22 composed of a p-type semiconductor are connected in series. A bump 18 is provided on an electrode 14 electrically connected to an integrated circuit 12. The first resistance element 20 includes a first overlapping part 24 overlapping with the bump 18 and having a first resistance value. The second resistance element 22 includes a second overlapping part 26 overlapping with the bump 18 and having a second resistance value. The first overlapping part 24 has a property in which the first resistance value lowers in proportion to a load applied thereto. The second overlapping part 26 has a property in which the second resistance value increases in proportion to a load applied thereto. The lowering rate of the first resistance value is x times the increase rate of the second resistance value. The first resistance value is 1/x times the second resistance value. |
