| 摘要 |
PROBLEM TO BE SOLVED: To provide an organic EL device in which warpage is reduced, even if the difference of linear expansion coefficient is large between a circuit substrate and a display substrate.SOLUTION: In the organic EL device including a substrate (H), a surface sealant, a substrate (L), and a shape holding layer in this order, an organic EL element is arranged on the substrate (H) or substrate (L). The substrate (H) has a linear expansion coefficient larger than that of the substrate (L), and the difference of linear expansion coefficient is 5×10cm/cm/°C or more. The shape holding layer contains a thermoplastic polymer having a softening point of 110°C or higher, and the difference of linear expansion coefficient between the shape holding layer and the substrate (H) is 160×10cm/cm/°C or less. |
