| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component that suppresses an inflow of sealing resin into an opposition space through annular joining material.SOLUTION: An electronic component 1 includes: an insulating substrate 11; a substrate annular layer 18 disposed on a surface of the insulating substrate 11; a piezoelectric substrate 19, an element annular layer 26 disposed on a surface of the piezoelectric substrate 19 and opposed to the substrate annular layer 18; annular solder 10 interposed between the substrate annular layer 18 and the element annular layer 26 to join them; and a resin part 9 covering an outer periphery of the annular members. The substrate annular layer 18 has discontinuity portions 18s interconnecting the inside and outside of the annulus. |
