发明名称 MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE WITH HEAT SINK AND SUBSTRATE FOR POWER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a substrate for a power module with a heat sink which is formed by brazing a metal layer to the heat sink with flux so as to avoid peeling in a joint part between a ceramic substrate and the metal layer and achieves high joint reliability.SOLUTION: In a manufacturing method of a substrate for a power module with a heat sink, the heat sink is joined to the substrate for the power module to manufacture the substrate for the power module with the heat sink. The manufacturing method includes: a primary joining process where a substrate joining surface of a metal layer is brazed with a ceramic substrate using a brazing material and the substrate for the power module is formed; and a secondary joining process where a heat sink joining surface of the metal layer is joined to the heat sink by brazing using the flux. Before the secondary joining process, reactive powder, such as TiO, SiO, MgO, which reacts with the flux is blown onto a side surface of the metal layer to be fastened, and the reactive power is reacted with the flux in the secondary joining process.
申请公布号 JP2013157524(A) 申请公布日期 2013.08.15
申请号 JP20120018228 申请日期 2012.01.31
申请人 MITSUBISHI MATERIALS CORP 发明人 AOKI SHINSUKE;NAGASE TOSHIYUKI
分类号 H01L23/40;H05K7/20 主分类号 H01L23/40
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