发明名称 ELECTROSTATIC CHUCK AND SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an electrostatic chuck which allows its thickness to be reduced as a whole and has excellent followability in temperature control.SOLUTION: In an electrostatic chuck, an electric heater 52 is built in an electrostatic chuck body 51 of an electrostatic chuck 24. The electric heater 52 comprises: a plate-shaped resistor 55; and an upper electrode plate 53 and a lower electrode plate 54 arranged to contact with a front surface and a rear surface of the plate-shaped resistor 55, respectively. The upper electrode plate 53 also serves as a high voltage electrode plate for electrostatically chucking a wafer W which is a substrate to be processed. The lower electrode plate 54 is divided into a lower inner electrode plate 54a and a lower outer electrode plate 54b.
申请公布号 JP2013157640(A) 申请公布日期 2013.08.15
申请号 JP20130099561 申请日期 2013.05.09
申请人 TOKYO ELECTRON LTD 发明人 MATSUYAMA SHOICHIRO
分类号 H01L21/683;H01L21/3065 主分类号 H01L21/683
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