| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of attaching a heating component to an electronic substrate, which is used for transmitting heat generated in the heating component mounted on the electronic substrate to an attachment base and radiating the heat, with a simple structure.SOLUTION: A through hole is provided immediately below an electronic substrate where a heating component requiring heat radiation is mounted, and the through hole is filled with solder. Further, the heating component is soldered with solder having a melting point lower than that of the solder filling the through hole. The structure prevents the solder from melting to areas other than an electric contact through the through hole. |
