发明名称 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 In a suspension board, a conductor layer having a predetermined pattern is formed on the upper surface of a first insulating layer. The first insulating layer has a thick portion having a large thickness and a thin portion having a small thickness. A reinforcing layer is formed on the upper surface of the first insulating layer so as to overlap with a boundary between the thick portion and the thin portion.
申请公布号 US2013206458(A1) 申请公布日期 2013.08.15
申请号 US201213683717 申请日期 2012.11.21
申请人 IHARA TERUKAZU;NITTO DENKO CORPORATION 发明人 IHARA TERUKAZU
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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