EXTENDED DEFECT SIZING RANGE FOR WAFER INSPECTION

摘要

An embodiment relates to a system configured to inspect a substrate. The system includes an image sensor configured to not have an anti-blooming feature such that when a pixel in the image sensor reaches full well capacity, excess charge flows from the pixel to one or more neighboring pixels in the image sensor. In addition, the system includes a computer subsystem configured to detect the defects on the wafer using the output generated by a pixel and any neighboring pixels of the pixel to which the excess charge of the pixel flows.