| 摘要 |
<p>A metal plate (3a) and metal plates (3b-3d) are disposed with a space between the metal plate (3a) and the metal plates (3b-3d). The metal plates (3b-3d) are separated from each other. Transistor elements (1a-1c) are mounted on the metal plate (3a), and the lower surfaces of the transistor elements are commonly bonded to the metal plate (3a). Transistor elements (1d-1f) are mounted on the metal plates (3b-3d), respectively, and the lower surfaces of the transistor elements are individually bonded to the metal plates (3b-3d), respectively. Wiring members (5a-5c) that are separated from each other are individually bonded to the upper surfaces of the transistor elements (1a-1c), respectively. A wiring member (5d) is commonly bonded to the upper surfaces of the transistor elements (1d-1f). The metal plates (3a-3d), the transistor elements (1a-1f), and wiring members (5a-5d) are covered with a molding resin (7).</p> |
