| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer grinding device capable of improving performance of grinding, while suppressing an increase in installation space associated with an increase in wafer size as much as possible.SOLUTION: A grinding device 1 includes: a support means 2 having a support surface 22 for supporting a wafer WF from a front surface side; a grinding means 3 for grinding a rear side of the wafer WF using a grinding member 31 including a grinding base 32 and grindstone chips 33 provided at predetermined intervals along an outer peripheral direction of the grinding base 32; a slurry supply means 4 for supplying slurry into a space surrounded by the grinding base 32, the grindstone chips 33 and the rear side of the wafer WF; and a moving means 5 for relatively moving the support means 2 and the grinding member 31 to adjust the thickness of the wafer WF after grinding, wherein the support surface 22 is a slope inclined with respect to a horizontal plane, and the moving means 5 relatively moves the support means 2 and the grinding member 31 in a direction perpendicular to the slope and in a direction parallel to the slope. |
