| 摘要 |
PROBLEM TO BE SOLVED: To relieve defects in the unit of memory bank without providing a redundant bank in a core chip and without newly providing a current path corresponding to a redundant bank.SOLUTION: A semiconductor device includes a core chip CC0 including memory banks B0-B7, and an interface chip IF placed on the core chip CC0 and serving as an interface between the core chip CC0 and outside, with the interface chip IF having a redundant bank RB0 configured to be replaceable with one defective memory bank of the memory banks B0-B7 of the core chip CC0. |
