发明名称 HEAT PUMP CYCLE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat pump cycle device which is suppressed in the vibration of injection piping and improved in design freedom.SOLUTION: A heat pump cycle device 100 comprises injection piping 14 which connects a clearance between a use-side heat exchanger 3 and a first expansion valve 4, and an intermediate pressure part of a compressor 1, and is arranged with an electromagnetic valve 21 and a second expansion valve 22 in series. A bypass pipe 15 for bypassing the second expansion valve 22 and having a capillary tube 23 is arranged at the injection piping 14. When actuating a refrigerant circuit as a heating cycle, a control means 60 performs start-time injection control for opening the electromagnetic valve 21 and fully closing the second expansion valve 22, and when operating the refrigerant circuit as the heating cycle, the control means performs operation-time injection control for fully closing the second expansion valve 22 or bringing it to a prescribed opening by referring to an expansion valve opening table.
申请公布号 JP2013155992(A) 申请公布日期 2013.08.15
申请号 JP20120018967 申请日期 2012.01.31
申请人 FUJITSU GENERAL LTD 发明人 SHIMADA SOTA
分类号 F25B1/00;F25B1/04 主分类号 F25B1/00
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