发明名称 |
Semiconductor Device and Method of Forming a Shielding Layer Over a Semiconductor Die After Forming a Build-up Interconnect Structure |
摘要 |
A semiconductor device is made by forming an interconnect structure over a substrate. A semiconductor die is mounted to the interconnect structure. The semiconductor die is electrically connected to the interconnect structure. A ground pad is formed over the interconnect structure. An encapsulant is formed over the semiconductor die and interconnect structure. A shielding cage can be formed over the semiconductor die prior to forming the encapsulant. A shielding layer is formed over the encapsulant after forming the interconnect structure to isolate the semiconductor die with respect to inter-device interference. The shielding layer conforms to a geometry of the encapsulant and electrically connects to the ground pad. The shielding layer can be electrically connected to ground through a conductive pillar. A backside interconnect structure is formed over the interconnect structure, opposite the semiconductor die.
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申请公布号 |
US2013207247(A1) |
申请公布日期 |
2013.08.15 |
申请号 |
US201313845329 |
申请日期 |
2013.03.18 |
申请人 |
STATS CHIPPAC, LTD.;STATS CHIPPAC, LTD. |
发明人 |
PAGAILA REZA A.;HUANG RUI;LIN YAOJIAN |
分类号 |
H01L23/552;H01L21/56 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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