摘要 |
A method of removing a desired part of a thin sheet (20) from a thin sheet bonded to a carrier (10) by a bonded area (40) that surrounds a non-bonded area (50), wherein the method includes forming a perimeter vent (60) defining a perimeter of the desired part (56), wherein the perimeter vent is disposed within the non-bonded area and has a depth.. 50% of the thickness (22) of the thin sheet. Prior to removing the desired part, a device may be processed onto the thin sheet. In some processes, the carrier is diced so it may be processed in smaller sizes, yet maintains a hermetically sealed edge. After dicing, an additional part of the device may be processed onto the thin sheet, and the desired part is removed by removing a desired part of the thin sheet from the carrier. |
申请人 |
CORNING INCORPORATED;ABRAMOV, ANATOLI ANATOLYEVICH;BELLMAN, ROBERT ALAN;BOOKBINDER, DANA CRAIG;CHUANG, TA-KO;DOMEY, JEFFREY JOHN;ENICKS, DARWIN GENE;GASKILL, LINDA;KANG, KIAT CHYAI;KEMMERER, MARVIN WILLIAM;KUO, KUAN-TING;LIN, JEN-CHIEH;MANLEY, ROBERT GEORGE;THOMAS, JOHN CHRISTOPHER;TSENG, PEI-LIEN;ZHANG, JIAN-ZHI JAY |
发明人 |
ABRAMOV, ANATOLI ANATOLYEVICH;BELLMAN, ROBERT ALAN;BOOKBINDER, DANA CRAIG;CHUANG, TA-KO;DOMEY, JEFFREY JOHN;ENICKS, DARWIN GENE;GASKILL, LINDA;KANG, KIAT CHYAI;KEMMERER, MARVIN WILLIAM;KUO, KUAN-TING;LIN, JEN-CHIEH;MANLEY, ROBERT GEORGE;THOMAS, JOHN CHRISTOPHER;TSENG, PEI-LIEN;ZHANG, JIAN-ZHI JAY |