发明名称 SUBSTRATE TRANSFER APPARATUS, COMPONENT MOUNTING APPARATUS, SUBSTRATE TRANSFER METHOD AND SUBSTRATE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate transfer apparatus, a component mounting apparatus, a substrate transfer method and a substrate manufacturing method, which can reduce time required for processing on a substrate such as component mounting.SOLUTION: A substrate transfer apparatus according to an embodiment of the present technology comprises a first rail, a second rail, a first lifting unit and a second lifting unit. The first rail transfers a first substrate in a first direction. The second rail is arranged next to the first rail in a second direction perpendicular to the first direction and transfers a second substrate in the first direction. The first lifting unit is movable in a third direction perpendicular to both the first and second directions and includes a first lifting part placed below a first position on the first rail which is a lifting position of the first substrate. The second lifting unit is movable in the third direction and includes a second lifting part placed below a second position on the second rail which is a lifting position of the second substrate, and next to the first lifting part in the first direction.
申请公布号 JP2013157507(A) 申请公布日期 2013.08.15
申请号 JP20120017904 申请日期 2012.01.31
申请人 SONY CORP 发明人 MATSUI TOMOHITO
分类号 H05K13/02;H05K13/04 主分类号 H05K13/02
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