发明名称 METHOD AND APPARATUS FOR MANUFACTURING MULTILAYER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing a multilayer substrate that can equalize thickness of the multilayer substrate manufactured, while controlling increase of a manufacturing cost.SOLUTION: A method includes: disposing an intervening plate 36 having a protruded shape in an opposite side with a laminate 30, at an end side in a lamination direction to the laminate 30 obtained by laminating a core substrate 24 and an adhesive sheet 28; and applying pressure to the laminate 30 and the intervening plate 36 in a lamination direction.
申请公布号 JP2013154510(A) 申请公布日期 2013.08.15
申请号 JP20120015767 申请日期 2012.01.27
申请人 FUJITSU LTD 发明人 ISHIDA HIDEKI
分类号 B29C65/50;B32B37/10;H05K3/00 主分类号 B29C65/50
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