发明名称 BACK SIDE ILLUMINATION IMAGING ELEMENT AND IMAGING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an imaging element which has good focus detection accuracy though pixels are more microfabricated; and provide a manufacturing method of the imaging element and an imaging apparatus including the imaging element.SOLUTION: In a back side illumination imaging element in which a plurality of pixels are arranged in a matrix in a plane, the plurality of pixels include imaging pixels and focus detection pixels 211. Each of the imaging pixel and the focus detection pixel 211 includes a semiconductor layer 16 which has a photoelectric conversion part 15a formed on one surface and a light-receiving surface on the other surface, and a wiring layer 17 which has wiring for reading out signals from the photoelectric conversion part 15a. Each of the wiring layer of the imaging pixel and the wiring layer 17 of the focus detection pixel is arranged on the one surface side of the semiconductor layer 16. The imaging pixel includes on the other surface side of the semiconductor layer, a color filter which allows light of a particular wavelength band to pass. The focus detection pixel 211 includes in a layer corresponding to the color filter of the imaging pixel, a light-shielding film 18 which shields a part of incident light on the other surface of the semiconductor layer 16.
申请公布号 JP2013157622(A) 申请公布日期 2013.08.15
申请号 JP20130062725 申请日期 2013.03.25
申请人 NIKON CORP 发明人 MURATA HIRONOBU
分类号 H01L27/14;H01L27/146;H04N5/369;H04N5/374 主分类号 H01L27/14
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