发明名称 |
METHOD OF MANUFACTURING A CHEMICAL MECHANICAL PLANARIZATION PAD |
摘要 |
The present disclosure relates to a process for forming a chemical mechanical planarization pad. The process includes forming a chemical mechanical planarization pad including a polymer matrix and an embedded structure by heating the polymer matrix and the embedded structure at a first temperature T1 and a first pressure P1. The chemical mechanical planarization pad is then allowed to deform at a second temperature T2 and a second pressure P2. The chemical mechanical planarization pad is then compressed at given mold cavity thickness by applying heat at a third temperature T3, wherein T1>T2, P1>P2, T1@T3.
|
申请公布号 |
US2013205679(A1) |
申请公布日期 |
2013.08.15 |
申请号 |
US201313766930 |
申请日期 |
2013.02.14 |
申请人 |
INNOPAD, INC.;INNOPAD, INC. |
发明人 |
ALDEBORGH JOHN ERIK;RENTELN PETER;DOLAN ROBERT P. |
分类号 |
B24D18/00 |
主分类号 |
B24D18/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|