| 摘要 |
An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10-6/K to 3.4×10-6/K. The interposer further includes a number of holes having diameters ranging from 20 mum to 200 mum. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.
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