发明名称 HEAT PUMP DEVICE
摘要 A heat pump device heats a second heat medium to a high temperature with high efficiency by using a secondary-loop refrigeration cycle while achieving a cooling operation and a heating operation simultaneously in a state where reliability and efficiency are ensured. In a heat pump device, a heat medium relay unit and a water heating unit are each provided with two connection ports that are connectable to refrigerant pipes, a refrigerant circuit and a refrigerant circuit are connected to each other via a heat exchanger included in the water heating unit, and a second heat medium is heated in a heat exchanger.
申请公布号 US2013205824(A1) 申请公布日期 2013.08.15
申请号 US201013880191 申请日期 2010.12.07
申请人 MORIMOTO HIROYUKI;YAMASHITA KOJI;MITSUBISHI ELECTRIC CORPORATION 发明人 MORIMOTO HIROYUKI;YAMASHITA KOJI
分类号 F24F3/06;F24H4/02;F25B7/00;F25B30/02 主分类号 F24F3/06
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