发明名称 FILM-FORMING APPARATUS AND FILM-FORMING METHOD
摘要 <p>Provided is a film-forming apparatus which is characterized in being provided with: a substrate carry-in unit, which carries in substrates; a film-forming unit, which forms films on the carried in substrates; a substrate carry-out unit, which carries out the substrates having the films formed thereon; a return unit, which connects the substrate carry-in unit and the substrate carry-out unit; a first adjusting unit, which is connected to the film-forming unit, and transfers the substrates to the film-forming unit, while adjusting, in a first space, transfer speed of the substrates; a second adjusting unit, which is connected to the film-forming unit, and which transfers the substrates carried out from the film-forming unit, while adjusting, in a second space, the transfer speed of the substrates; a carry-in buffer unit, which connects the substrate carry-in unit and the first adjusting unit to each other, and which has a storing chamber having one or more shelves, said storing chamber being capable of temporarily storing the substrates before carrying the substrates into the first space; and a carry-out buffer unit, which connects the second adjusting unit and the substrate carry-out unit to each other, and which has a storing chamber having one or more shelves, said storing chamber being capable of temporarily storing the substrates after the substrates are carried out from the inside of the second space.</p>
申请公布号 WO2013118764(A1) 申请公布日期 2013.08.15
申请号 WO2013JP52709 申请日期 2013.02.06
申请人 TOKYO ELECTRON LIMITED 发明人 NISHIMURA, MASARU;YAMAGUCHI, KEIICHI
分类号 C23C14/24;H01L21/677;H01L51/50;H05B33/10 主分类号 C23C14/24
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