| 摘要 |
PROBLEM TO BE SOLVED: To provide a foreign substance removing apparatus capable of removing foreign substances on a side face and a rear face of a semiconductor chip, and a foreign substance removing method.SOLUTION: A foreign substance removing apparatus comprises a jig, a foreign substance adsorbing member, charge means and slide means. The jig includes a plate on which a through hole is formed, and a frame which is formed on the plate so as to individually accommodate a plurality of semiconductor chips. The foreign substance adsorbing member includes a first charge part having a first flat surface and a second charge part which is insulated from the first charge part and has a second flat surface constituting one plane together with the first flat surface. The charge means positively charges the first flat surface and negatively charges the second flat surface. The slide means slides one of the jig and the foreign substance adsorbing member with respect to the other while confronting the through hole of the jig and the first and second flat surfaces with a fixed interval interposed therebetween. The through hole is formed for each region partitioned by the frame. |
