| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting device with high reliability by restraining warpage of a lead electrode due to a thermal stress.SOLUTION: A light emitting device comprises: a first lead frame and a second lead frame; a light emitting element flip-chip mounted on the first lead frame and the second lead frame; and a resin molding surrounding circumferences of the first lead frame and the second lead frame. A reinforcing member made of a material with a smaller linear expansion coefficient than that of the first and second lead frames and fixing the first and second lead frames is provided inside the resin molding. |
