| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoradically curable resin composition which has a high refractive index, excellent heat resistance and light resistance, is excellent in curability even in the form of a thick film, and can form a cured product capable of retaining a low linear expansion coefficient and a low rate of shrinkage, and to provide a cured product of the composition.SOLUTION: A photosensitive resin composition includes 100 pts.mass of a photosensitive silicon resin (A) including metal oxide fine particles having a refractive index of ≥1.6 and a photoradically reactive group and 0.01-50 pts.mass of a photoradical polymerization initiator (B), wherein the equivalent weight of the photoradically reactive group included in the photosensitive resin composition is 0.2-10 mmol/g. |
