| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor component which allows easy detachment of a support substrate after encapsulation by a molding resin.SOLUTION: In a manufacturing method of a semiconductor component 6 in which a plurality of semiconductor chips 1 are mounted on a support substrate 2 via a double-sided adhesive tape 3 and the support substrate 2 and the double-sided adhesive tape 3 are detached by irradiation of light from the support substrate 2 side of the semiconductor component 6 encapsulated by an encapsulation resin 5, the double-sided adhesive tape 3 includes: a gas-generating agent-containing photo-curing adhesive layer 32 which contains a gas-generating agent that generates gas by irradiation of light, and which is arranged on a base material 31 on the side to be adhered to the support substrate 2; and a high-cross-linkage low-polarity photo-curing adhesive layer 33 which has a degree of cross-linkage of 70-90% and a surface polarity of 45 dyn/cmor less, and which is arranged on the base material 31 on the side to be adhered to the semiconductor chip 1. |
