发明名称 SUBSTRATE HOLDER AND PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To absorb a change in thickness of a substrate while preventing deflection of the substrate even if the thickness of the substrate varies, and to hold the substrate while keeping a compression dimension of a substrate sealing member within a certain range more stably.SOLUTION: A substrate holder includes: a first holding member 54 and a second holding member 58, both for detachably holding a substrate W by clamping a peripheral portion of the substrate W therebetween; and a substrate sealing member 66 mounted to the second holding member 58 and sealing an interval between the second holding member 54 and the peripheral portion of the substrate W along a substrate sealing line 64 when the substrate W is held by the second holding member 58 and the first holding member 54. The first holding member 54 includes a thickness absorbing mechanism 88 including a movable base 82 and a compression spring 86, for example, which bias the substrate W toward the second holding member 58 at positions along the substrate sealing line 64 to absorb a change in thickness of the substrate W when the first holding member and the second holding member 58 hold the substrate by clamping the peripheral portion of the substrate W therebetween.
申请公布号 JP2013155405(A) 申请公布日期 2013.08.15
申请号 JP20120016167 申请日期 2012.01.30
申请人 EBARA CORP 发明人 FUJIKATA JUNPEI
分类号 C25D17/06 主分类号 C25D17/06
代理机构 代理人
主权项
地址