发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board having a conductor with an excellent high-temperature and anti-oxidation performance.SOLUTION: A wiring board comprises: an insulation substrate 1 made of a ceramic sintered compact; a conductor layer 2 made of an alloy material mainly composed of tungsten, chromium and molybdenum, and provided on the insulation substrate 1; a protection layer 4 made of platinum or a metallic material mainly composed of platinum, and interposed between an outer peripheral portion of the conductor layer 2 and the insulation substrate 1; and an interposed layer 3 mainly composed of at least one of tungsten and molybdenum, and interposed between the conductor layer 2 and the insulation substrate 1 on an inner side than the protection layer 4 in a plane view. A chromium component of the conductor layer 2 is restrained from being dispersed to the insulation substrate 1 by the interposed layer 3, and the interposed layer 3 is restrained from being oxidized by the conductor layer 2 and the protection layer 4, so as to provide a wiring board with an excellent high-temperature and anti-oxidation property.
申请公布号 JP2013157388(A) 申请公布日期 2013.08.15
申请号 JP20120015408 申请日期 2012.01.27
申请人 KYOCERA CORP 发明人 MAKINO HIROSHI;KAMASE YUSHI;MATSUMOTO HIROSHI
分类号 H05K1/09;H05K1/03;H05K1/11;H05K3/40 主分类号 H05K1/09
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