发明名称 FILM IN-MOLD INJECTION MOLD DEVICE AND MOLDING METHOD USING THE SAME
摘要 A film in-mold injection mold device, including: a first mold that has an injection port configured to inject a molding material; and a second mold that is configured to face the first mold and has a sucking mechanism configured to suck a film to be supplied at a time of molding, wherein the second mold has a movable protruding part configured to touch, when the film is sucked, the film before the film touches an outer periphery edge part of a concave part which is formed on the second mold depending on a shape of an article to be molded, so as to temporarily ensure a space between the outer periphery edge part and the film.
申请公布号 US2013207320(A1) 申请公布日期 2013.08.15
申请号 US201313741451 申请日期 2013.01.15
申请人 PANASONIC CORPORATION;PANASONIC CORPORATION 发明人 MARUICHI TAISHI;TSUJII TARO;MINE HIDEO
分类号 B29C45/14 主分类号 B29C45/14
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