| 摘要 |
PROBLEM TO BE SOLVED: To stably remove a grinding liquid by an air blow means by making a distance between a workpiece and the air blow means constant even if an amount to be ground on the workpiece varies. SOLUTION: When the grinding liquid L attaching to a lower surface of a wafer (workpiece) 1 is blown off by spraying the air from the air blow means 90 to the lower surface during a process of carrying the ground wafer 1 picked up from a chuck table 30 by a collecting means 70 to a spinner cleaning device 80, an amount of raising a rotation axis 71 when picking up the wafer 1 by the collecting means 70 is controlled based on the amount to be ground, whereby a distance in a vertical direction between the lower surface of the wafer 1 and the air blow means becomes constant (optimum air blowing distance d). COPYRIGHT: (C)2010,JPO&INPIT |
