| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bond agent composition without causing any bleeding after being applied onto a substrate, and to provide a semiconductor device using the die bond agent. SOLUTION: The die bond agent composition includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent and (D) inorganic filler, wherein at least one of the (A) component and the (B) component contains a silicone modified resin containing a siloxane residue expressed by formula (1) (where, R<SP>1</SP>s represent individually 1-10C univalent hydrocarbon group and (n) represents integers of 1-100), the (D) component contains 1-50 pts.mass inorganic filler obtained by surface-treating silica powder having 50-500 m<SP>2</SP>/g specific surface area measured by BET method with an organic silicon compound per 100 pts.mass in total of the siloxane residue and the silane coupling agent detected by head space GC/MS analysis of the die bond composition is <0.1 wt.% of the weight of the solid portion of the composition. COPYRIGHT: (C)2009,JPO&INPIT |
